Basic Info.
Product Description
4 layer, 0.4 mm finished board thickness
ENIG
Au: 2-2.9u''
Ni: 3um
Min width/space: 0.12mm/0.14mm
Available surface finish _ Flash Gold / Hard Gold Plating / Immersion Nickel / Gold / Silver/ Tin
Hot Air Solder Leveling / HAL Lead-Free / Selective Plating / Entek Coating (OSP) / Milling Process / V-Cut Process / Gold Finger Process / Peelable Mask / Carbon Ink Printing
Engineering capability
Positioning				 + / - mm	+ / - inches
1. Hole or center position tolerance				0.050	0.002
2. Pattern registration with outline				0.076	0.003
3. Punching shift with outline				 0.150	0.006
4. Min. Clearance between Holes and outline		Equal to Board Thickness
Hole size Tolerance					+ / - mm	+ / - inches
1. Minimum Finished Hole size		0.300	0.014
2. Maximum drill size				6.500	0.256
3. Maximum Aspect Ratio			4
4. Hole size tolerance		(PTH)	0.075	0.003
		 (NPTH)	0.050	0.002
5. Drill hole to drill hole pitch tolerance (t < 0.6 mm)				0.075	0.003
Outline Tolerance					+ / - mm	+ / - inches
1. Punched Outline Dimension				0.150	0.006
2. Routed outline Dimension				0.130	0.005
Plating Tolerance
1. Minimum PTH thickness				3 um
2. Minimum Gold thickness				0.03 um
3. Minimum Nickel thickness			3 um
4. Max. Cu THK. 				28 um
5. Max. Ni THK. 				10 um
6. Max. Au THK. 				3 um
7. Hot Air solder levelling		2 - 38 um
Solder Mask					+ / - mm	+ / - inches
1. Minimum Opening			0.10	0.005
2. Minimum trace				0.08
3. Min. Trace between pads		0.20
4. Registration tolerance		0.10
5. Mask thickness on		 bare base material		0.7 to 1.2 mil
		 pads		 0.6 to 1.0 mil
		 traces		 0.2 to 0.5 mil
V - Cutting (scoring)
Board shape must have at least 2 parallel lines for V-score!
1. Min. Remaining thickness			for FR4	0.3+/-0.1
		 for CEM3	or CEM 1	0.5+/-0.1
Inner Layers					+ / - mm	+ / - inches
1. Min. Annualar ring			0.01	0.0005
2. Min. Line width				0.12	0.0050
3. Min. Spacing				0.13	0.0050
4. Registration tolerance		+/-0.13	+/-. 005
CMOS Cavity Requirements
1. Remain THK. Of the Cavity	+/- 0.05
2. Dimension of Cavity		+/- 0.15
3. Location of Cavity			+/- 0.15
Panel Size
Maximum Panel Size			18 " X 24"
Maximum Circuit Size			17" X 22"
				 + / - mm	+ / - inches
2. Location tolerance				+/-0.2
3. Maximum board size for V-cut	15.25"
4. Min. Board size for V-cut			4"
5. Min. THK. Requirement for V-cut	0.6 mm
6. Angle available to choose		30 and 45 degree
7. V-cut to outline tolerance			+/- 0.15
Chamfering
1. Tolerance				+/-0.15mm
2. Angles in bevelling		45 & 60
Angular tolerance
For board THK. = or < 0.6mm's outline	+/- 0.5 degree
Long routing and complex outline